Method for electrolessly depositing a metal onto a

专利名称：Method for electrolessly depositing a metal

onto a substrate using mediator ions

发明人：Gerald Lee Ballard,John Gerard Gaudiello申请号：US08/202536申请日：19940228公开号：US06042889A公开日：20000328

摘要：An electroless metal plating bath composition, a corresponding method forelectrolessly depositing a metal onto a substrate surface, as well as the resulting,metallized substrate, are disclosed. The inventive bath composition includes water, asoluble source of the metal ions it is desired to chemically reduce at, and deposit onto,the substrate surface of interest, and a complexing agent for the metal ions. In addition,the bath composition includes a soluble source of any one or more of a select group ofwhat are termed mediator ions, which group includes palladium (Pd), platinum (Pt), silver(Ag), ruthenium (Ru), iridium (Ir), osmium (Os) and rhodium (Rh) ions, as well as acomplexing agent for the mediator ions. Moreover, the bath composition includes achemical reducing agent, which primarily serves to chemically reduce the mediator ions atthe substrate surface of interest. Significantly, by using an appropriate ratio of theconcentration of the metal ions in solution to the concentration of the mediator ions insolution, and depending upon which mediator ions are used, the inventive bathcomposition serves to electrolessly deposit the metal of interest onto the substratesurface of interest, with the resulting deposited metal containing less than or equal toabout 3.0 atomic percent, or less than or equal to about 2.0 atomic percent, or even less

than or equal to about 1.0 atomic percent, of the corresponding mediator metal.

申请人：INTERNATIONAL BUSINESS MACHINES CORPORATION

代理人：Bernard Tiegerman,Lawrence R. Fraley

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