HSMA-A461-X83M1资料

HSMx-A46x-xxxxx

SMT LED Surface Mount LED Indicator

Data Sheet

Description

The Power PLCC-4 SMT LED with Lens are high perfor-mance PLCC-4 package size SMT LEDs targeted mainly in Automotive & Electronics Signs and Signals (ESS) markets. These top-mount single-chip packages with focused radiation offer high brightness in beam direc-tion and are excellent for interior automotive, indoor and outdoor sign and industrial applications. With ad-ditional lens in 50° variants, these products are espe-cially fitting to applications for Mono-color Text Display, CHMSL and displays.

The PLCC-4 package family is able to dissipate heat bet-ter compared to the PLCC-2 packages. In proportion to this increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PLCC-2 SMT LEDs.

As an extension of the standard flat top PLCC-4 SMT LEDs, the Power PLCC-4 with Lens device is able to pro-vide focused beams within narrow viewing angles (50°) meeting the market’s requirements for focused radia-tion and high brightness in beam directions.

The Power PLCC-4 SMT LED with 50° is ideal for panel, push button, general backlighting, automotive interior & exterior (cluster backlighting, side repeaters, brake lights), sign and symbol illumination, office equipment, industrial equipment and home appliances applica-tions. This package design coupled with careful selec-tion of component materials allow the Power PLCC-4 SMT LED with Lens to perform with higher reliability in a larger temperature range -40°C to 100°C. This high reliability feature is crucial to allow the Power PLCC-4 SMT LED with Lens to do well in harsh environments such as its target Automotive & ESS markets. The Power PLCC4 SMT LED with Lens package is also designed to be compatible with both IR-solder re-flow and through-the-wave soldering.

Features

• Industry standard PLCC-4• High reliability LED package

• High brightness using AlInGaP dice technologies• High optical efficiency• Narrow Viewing angle at 50°

• Available in 8mm carrier tape on 7-inch reel

Applications

• Interior automotive

– Instrument panel backlighting– Central console backlighting– Cabin backlighting

– Navigation and audio system– Dome lighting

– Push button backlighting• Exterior automotive– Turn signals– CHMSL

– Rear combination lamp

– Side repeaters

• Office automation, home appliances, industrial equipment– Front panel backlighting– Push button backlighting– Display backlighting

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Package Drawing

Note:

1. All Dimensions in millimeters.2. Terminal Finish: Ag plating

3. Electrical connection between all cathode is recommended

Figure 1. Package Drawing

Pin1234

HSMx-A46x

Lead ConfigurationCathodeAnodeCathodeCathode

Table 1. Device Selection Guide

Luminous Intensity, FV [1] (mcd)

ColorAmberAmberRedRedOrange

Part NumberHSMA-A460-W50M1HSMA-A461-X83M1HSMC-A460-U30M1HSMC-A461-V00M1HSML-A461-W40M1

Min. Iv (mcd)112522404507151125

Typ. Iv (mcd)2100330058017501850

Max. Iv (mcd)

35505600900-2850

Test Current (mA)

5050505050

Dice Technology

AlInGaPAlInGaPAlInGaPAlInGaPAlInGaP

Notes:

1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis.2. Tolerance = ±12%

2

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Part Numbering System

H S M x1− Ax2 x3x4−x5x6 x7 x8x9

Packaging OptionColor Bin SelectionIntensity Bin Selection

Device Specific ConfigurationPackage TypeLED Chip Color

Table 2. Absolute Maximum Ratings (TA = 25 °C)

ParametersDC Forward Current [1]Peak Forward Current [2]Power DissipationReverse VoltageJunction TemperatureOperating TemperatureStorage Temperature

HSMA/C/L70 mA200 mA180 mW5 V110°C-40 °C to +100 °C-40 °C to +100 °C

Notes:

1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz

Table 3. Optical Characteristics (TA = 25 °C)

PeakDominant Wavelength Wavelength lPEAKlD [1](nm)(nm)Typ.592635609

Typ.590626605

Viewing

Angle2q½ [2](Degrees)Typ.505050

LuminousEfficacy hV [3] (lm/W)Typ.480150320

Luminous Efficiencyhe (lm/W)Typ.221923

Luminous Intensity/ Total Flux [4, 5] IV (cd) / FV (lm)

Typ.1.351.151.05

ColorAmberRedOrange

PartNumberHSMA-A46xHSMC-A46xHSML-A46x

DiceTechnologyAlInGaPAlInGaPAlInGaP

Notes:

1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device.2. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity.

3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens / watt.

4. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized.5. Flux tested at mono pulse conditions.

Table 4. Electrical Characteristics (TA = 25 °C)

Forward Voltage VF (Volts) @ IF = 50 mA

Part NumberHSMA-A46xHSMC-A46xHSML-A46x

Typ.2.202.202.20

Max.2.502.502.50

Reverse VoltageVR @ 100mA

Min.555

ThermalResistanceRqJ-P (°C/W)110110110

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1.00.90.8RELATIVE INTENSITY0.70.60.50.40.30.20.10.0380

430

480

530

580

630

680

730

780

WAVELENGTH - nm

AlInGaP AmberAlInGaP RedAlInGaP OrangeFigure 2. Relative Intensity Vs. Wavelength

8070

RELATIVE LUMINOUS INTENSITY(NORMALIZED AT 50 mA)FORWARD CURRENT - mA6050

HSMA/C/L4030201000

0.5

1

1.5

2

2.5

FORWARD VOLTAGE - V

1.61.41.210.80.60.40.200

10

20

30

40

50

60

70

80

DC FORWARD CURRENT - mA

HSMC/LHSMAFigure 3. Forward Current Vs. Forward Voltage.

2.5Figure 4. Relative Intensity Vs. Forward Current

NORMALIZED LUMINOUS INTENSITY 2AlInGaP Amber1.5AlInGaP OrangeAlInGaP Red10.50-50

-25

0

255075AMBIENT TEMPERATURE - °C

100

125

Figure 5. Relative Intensity Vs. Temperature

4

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80Am - TNERθJA = 300°C/WRR60

UC DRRθJA = 350°C/WAWR40

OF RθMJA = 470°C/WUMIXAM20

0

020406080100120AMBIENT TEMPERATURE - °C

Figure 6a. Maximum Forward Current Vs. Ambient Temperature.

Derated Based on TJMAX = 110°C, RqJ-A= 300°C/W, 350°C/W and 470°C/W.630625AlInGaP Redm620n - H615TGNE610LEAlInGaP OrangeVA605W TN600ANIM595OD590AlInGaP Amber5850

10

20

FORWARD CURRENT - mA

30405060

70

80

Figure 7. Dominant Wavelength Vs. Forward Current.10.9Y0.8TISN0.7ETN0.6I DEZ0.5ILAM0.4RON0.30.20.10-90

-60-300306090

ANGULAR DISPLACEMENT - DEGREES

Figure 9. Radiation Pattern

5

80

Am - TN60

ERRUC DRA40

WROF MUMI20

XAM0

020

406080100120

SOLDER POINT TEMPERATURE (°C)

Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated Based on TJMAX = 110°C, RqJ-P = 110°C/W.

0.15 V -0.1 TFIHS E0.05GATLOV D-50-2500255075100RAW-0.05ROF-0.1-0.15JUNCTION TEMPERATURE - °C

Figure 8. Forward Voltage Shift Vs. Temperature.

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10 to 20 SEC.217˚C255 ˚C +5˚C-0˚CTEMPERATURE-6˚C/SEC MAX.3˚C/SEC MAX.125˚C +/- 25˚C60-150 SEC.MAX. 120 SEC.TIMEFigure 10. Recommended Pb-free Reflow Soldering Profile.

Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indi-cator Components.

XX0.40 (0.016)1.10(0.043)0.50(0.020)4.50 (0.178)1.50 (0.059)YY2.60(0.103)ThermalResistance300°C/W350°C/W

Solder padarea (xy)>16mm2>12mm2>8mm2

DIMENSIONS IN mm (INCHES).SOLDER RESIST

REPRESENTS ELECTRICALCONNECTIVITY BETWEEN PADS

470°C/W

Figure 11a. Recommended Soldering Pad Patter

X6.1 (0.240)2.8 (0.110)X0.5 (0.020)Y2.0 (0.079)6.0 (0.236)3.0 (0.118)2.0 (0.079)Y1.0 (0.039)DIMENSIONS IN mm (INCHES).SOLDER RESIST

Figure 11b. Recommended Soldering Pad Patter (TTW)

REPRESENTS ELECTRICALCONNECTIVITY BETWEEN PADS

6

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Figure 12. Soft Tip Vacuum Pick-up Tool for extracting SMT LED Components from Carrier Tape.

TRAILERCOMPONENTLEADER200 mm MIN. FOR ∅ 180 REEL.480 mm MIN. FOR ∅ 180 REEL.200 mm MIN. FOR ∅ 330 REEL.960 mm MIN. FOR ∅ 330 REEL. USER FEED DIRECTIONFigure 13. Tape Leader and Trailer Dimensions.

Figure 14. Tape Dimensions.

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USER FEED DIRECTIONCATHODE SIDEPRINTED LABELFigure 15. Reeling Orientation.

Moisture Sensitivity

This product is qualified as Moisture Sensitive Level xx per Jedec J-STD-020. Precautions when handling this mois-ture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details.A. Storage before use

- Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating.- It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB

- The humidity indicator card (HIC) shall be read immediately upon opening of MBB.

- The LEDs must be kept at <30°C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours.C. Control for unfinished reel

- For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards

- If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours.

E. Baking is required if:

- “10%” or “15%” HIC indicator turns pink.

- The LEDs are exposed to condition of >30°C / 60% RH at any time.- The LEDs floor life exceeded 672 hours.

Recommended baking condition: 60±5°C for 20 hours.

8

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Intensity Bin Select (X5X6)

Individual reel will contain parts from one half bin only

X5

Min IV Bin

X60Full Distribution22 half bins starting from X5133 half bins starting from X5144 half bins starting from X5155 half bins starting from X5162 half bins starting from X5273 half bins starting from X5284 half bins starting from X529

5 half bins starting from X52

Intensity Bin Limits

Bin IDMin. (mcd)Max. (mcd)U1450.00560.00U2560.00715.00V1715.00900.00V2900.001125.00W11125.001400.00W21400.001800.00X11800.002240.00X22240.002850.00Y12850.003550.00Y23550.004500.00Z14500.005600.00Z25600.007150.00117150.009000.00129000.0011250.002111250.0014000.0022

14000.00

18000.00

Tolerance of each bin limit = ± 12%

Color Bin Select (X7)

Individual reel will contain parts from one full bin only.

X7

0Full DistributionZA and B onlyYB and C onlyWC and D onlyVD and E onlyUE and F onlyQA, B and C onlyPB, C and D onlyNC, D and E onlyMD, E and F only1A, B, C and D only3

B, C, D and E only4C, D, E and F only5A, B, C, D and E only6

B, C, D, E, and F only

Color Bin Limits

AmberMin. (nm)Max. (nm)A582.0584.5B584.5587.0C587.05.5D5.5592.0E592.0594.5F

594.5

597.0

OrangeMin. (nm)Max. (nm)A597.0600.0B600.0603.0C603.0606.0D606.0609.0E609.0612.0Red Min. (nm)Max. (nm)Full Distribution

620.0

635.0

Tolerance of each bin limit = ±1nm

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Packaging Option (X8 X9)

OptionTest CurrentPackage TypeReel SizeM1

50mA

Top Mount

7

VF Bin Limits

Bin IDMin.Max.VA1.92.2VB2.22.5VC2.52.8VD2.83.1VE

3.1

3.4

Tolerance of each bin limit = ±0.1V

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.AV02-0529EN - June 26, 2007